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Elastic Properties of Metallic Elements Used In Electronic Packaging
Metal Condition E
(Elastic)
(GPa) G
(Shear)
(GPa) Tensile Strength
(MPa) Yield Strength*
(MPa)
Aluminum 99.996 Annealed 68.9 26.5 47.4 12.2
Antimony 77.8 11
Copper 99.997 Rod, cold-drawn 127.7 46.8 351 340
Gold 99.99 Cast 74.4 124
Lead 99.90 Rolled, aged 9.5 (0.5 %)
Molybdenum Pressed, sintered sheet 340 690
Nickel >99.0 Wrought, annealed 210 482 138
Platinum 99.99 Annealed 147 120-130
Silver Strained 5 %, heated 5 hr at 350 C 71 – 78
Tin Pure, cast 41 – 45 21.4
Tin-5Ag Sheet, aged at room temp. 31.7 24.8
Tungsten 340 135
Zinc <0.10 Pb Hot-rolled strip 134-160
Material Properties of a Via-in-Pad Chip-Scale Package Printed Circuit Board Assembly Property
Material Young’s Modulus
(GPa) Poisson’s Ratio
(nu) Thermal Expansion Coefficient (alpha)
(10-6/K)
FR-4 epoxy-glass PCB substrate 22 0.28 18.5
Copper VIP
(via-in-pad) 76 0.35 17
Sn-37Pb
(eutectic) solder E=32.0-0.088·t (0 <= t <= 100, t is Celsius temp.) 0.4 21
Underfill 6 0.35 30
Silicon chip 131 0.3 2.8
Solder mask 6.9 0.35 19
*Al 69 0.33 22.8
*Si3Ni4 314 0.33 3
Micro-via filler 7 0.3 35
Bismaleimide
Triazene (BT) 26 0.39
Elastic Properties and Thermal Expansion Coefficient of Electronic - Packaging Materials and Lead Solder Alloys Material Temp.
(ºC) Young’s
Modulus,
(GPa) Poisson’sbr>Ratio (n ) Thermal Exp.
Coefficient (10-6/K)
Sn-37Pb
(eutectic) solder -70
20
140 38.1
30.2
19.7 0.4
0.4
0.4 24.0
24.0
24.0
Pb-10Sn -55
22
100 13.4
9.78
4.91 0.4
0.4
0.4 27.8
28.9
30.5
Alumina
(substrate) -55
22
100 303
303
303 0.21
0.21
0.21 3.9
4.5
6.7
Silicon chip -73
27
127 162
162
162 0.22
0.22
0.22 1.40
2.62
3.23
Polyimide PWB -55 to
125 14.5 0.16 13.0
Hysol
FP4526
Underfill -73
25
52
77
102
127 9.78
9.51
9.23
8.82
7.72
5.37 0.3
0.3
0.3
0.3
0.3
0.3 33.0
33.0
33.0
33.0
33.0
33.0 |
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